3N, 3N5, 4N, with Ta 99.99% min
ASTM 4 or finer
16Rms max. or Ra 0.4 ( RMS64 or better)
0.1mm or 0.15% max
+/-0.010" on all dimensions
It is welded with copper back target, and then semiconductor or optical sputtering is carried out to deposit tantalum atoms on the substrate material to realize sputtering coating. Tantalum targets are mainly used in semiconductor coating, optical coating and other industries. In the semiconductor industry, metal (Ta) is currently used to form a barrier layer by physical vapor deposition (PVD).
In addition to tantalum targets, we can also provide tantalum-silicon alloy, tantalum-aluminum alloy, tantalum-tungsten alloy, nickel-tantalum alloy, cobalt-zirconium-tantalum alloy, tantalum nitride, tantalum carbide, tantalum boride, tantalum pentoxide and other sputtering targets.